{"title":"高密度PC转换器的未来浪潮","authors":"A. Elbanhawy","doi":"10.1109/INTLEC.2006.251583","DOIUrl":null,"url":null,"abstract":"Recent advances in packaging and silicon design allow the design engineer to implement DC-DC converter designs breaking the current records in power density (Watt/in2) and current density (Amp/in2). We will discuss in details a recent design that boasts 400 Watt/in2 on standard 6-8 layer boards. This approach allows the design engineer to fully optimize both the electrical and PCB design as all the parasitic inductances and resistances are almost fully eliminated allowing high frequency high efficiency performance","PeriodicalId":356699,"journal":{"name":"INTELEC 06 - Twenty-Eighth International Telecommunications Energy Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Wave of the Future in High Density PC Converters\",\"authors\":\"A. Elbanhawy\",\"doi\":\"10.1109/INTLEC.2006.251583\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recent advances in packaging and silicon design allow the design engineer to implement DC-DC converter designs breaking the current records in power density (Watt/in2) and current density (Amp/in2). We will discuss in details a recent design that boasts 400 Watt/in2 on standard 6-8 layer boards. This approach allows the design engineer to fully optimize both the electrical and PCB design as all the parasitic inductances and resistances are almost fully eliminated allowing high frequency high efficiency performance\",\"PeriodicalId\":356699,\"journal\":{\"name\":\"INTELEC 06 - Twenty-Eighth International Telecommunications Energy Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-12-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"INTELEC 06 - Twenty-Eighth International Telecommunications Energy Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/INTLEC.2006.251583\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"INTELEC 06 - Twenty-Eighth International Telecommunications Energy Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/INTLEC.2006.251583","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Wave of the Future in High Density PC Converters
Recent advances in packaging and silicon design allow the design engineer to implement DC-DC converter designs breaking the current records in power density (Watt/in2) and current density (Amp/in2). We will discuss in details a recent design that boasts 400 Watt/in2 on standard 6-8 layer boards. This approach allows the design engineer to fully optimize both the electrical and PCB design as all the parasitic inductances and resistances are almost fully eliminated allowing high frequency high efficiency performance
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