{"title":"带冷却基板的四分之一波螺旋隔离器的传热分析","authors":"Youry V. Vountesmery","doi":"10.1109/ELNANO.2018.8477561","DOIUrl":null,"url":null,"abstract":"The heat transfer problem and related power limitation problem for the helicon isolators has been investigated. The heat dissipation from a crystal of a quarter-wave helicon resonator with unilateral metallization was discussed. A construction of the heat-conducting substrate for the quarter-wave helicon resonator was proposed. Simulation of the heat transfer and the maximum dissipation power estimation were submitted.","PeriodicalId":269665,"journal":{"name":"2018 IEEE 38th International Conference on Electronics and Nanotechnology (ELNANO)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Heat Transfer Analysis for Quarter-Wave Helicon Isolator with Cooling Substrate\",\"authors\":\"Youry V. Vountesmery\",\"doi\":\"10.1109/ELNANO.2018.8477561\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The heat transfer problem and related power limitation problem for the helicon isolators has been investigated. The heat dissipation from a crystal of a quarter-wave helicon resonator with unilateral metallization was discussed. A construction of the heat-conducting substrate for the quarter-wave helicon resonator was proposed. Simulation of the heat transfer and the maximum dissipation power estimation were submitted.\",\"PeriodicalId\":269665,\"journal\":{\"name\":\"2018 IEEE 38th International Conference on Electronics and Nanotechnology (ELNANO)\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 38th International Conference on Electronics and Nanotechnology (ELNANO)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ELNANO.2018.8477561\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 38th International Conference on Electronics and Nanotechnology (ELNANO)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELNANO.2018.8477561","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Heat Transfer Analysis for Quarter-Wave Helicon Isolator with Cooling Substrate
The heat transfer problem and related power limitation problem for the helicon isolators has been investigated. The heat dissipation from a crystal of a quarter-wave helicon resonator with unilateral metallization was discussed. A construction of the heat-conducting substrate for the quarter-wave helicon resonator was proposed. Simulation of the heat transfer and the maximum dissipation power estimation were submitted.
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