太赫兹在晶圆上的校准使用偏移短路,并通过称为标准

C. Caglayan, G. Trichopoulos, K. Sertel
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引用次数: 0

摘要

我们提出了一种新的晶圆上校准技术,使用定义良好的标准,可以替代广泛使用的毫米波和亚毫米波多线trl(透反射线)校准。我们的方法在固定探头的测量设置中特别有用,因为trl型校准通常需要测量探头之间的不同物理分离。作为晶圆上标准,使用具有不同电气延迟长度的偏移短路和简单的直通连接。通过使用非接触式探头测量Beatty标准(不匹配直通),在g波段(140-220 GHz)对该校准方法进行了实验验证。
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THz on-wafer calibration using offset-shorts and known through as standards
We present a novel on-wafer calibration technique using well-defined standards that can be an alternative to widely used multiline-TRL (thru-reflect-line) calibration in millimeter and submillimeter waves. Our method is specifically useful in measurement setups with fixed probes since TRL-type calibration typically requires different physical separation between measurement probes. As on-wafer standards, offset shorts with different electrical delay lengths and a simple through connection are used. Experimental validation of this calibration method is provided in G-Band (140-220 GHz) via measurement of a Beatty standard (mismatched thru) using non-contact probes.
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