{"title":"紧凑的LTCC天线包60 GHz无线传输的非压缩视频","authors":"S. Brebels, C. Soens, W. De Raedt, G. Vandenbosch","doi":"10.1109/MWSYM.2011.5972831","DOIUrl":null,"url":null,"abstract":"This paper proposes a compact antenna package in low-temperature co-fired ceramic (LTCC) technology for 60 GHz wireless transmission of uncompressed video. A 60 GHz active phased-array antenna is realized in the package by integrating 4 open-waveguide antenna elements at the top of the package with a 60 GHz CMOS chip at the bottom of the package. The LTCC build-up was designed to provide low interconnection loss between antenna elements and chip (insertion loss<1 dB), good antenna performance in the full unlicensed 60 GHz band (gain>5.3 dBi) and excellent shielding of the bottom side of the package containing the CMOS chip from the radiation emerging from the top side of the package (>40dB suppression). The low backside radiation allows the direct ball-grid array assembly of the package on a printed circuit-board. Only passive antenna arrays and interconnect lines were fabricated and tested in this paper. Separate transmitter (Tx) and receiver (Rx) modules were also designed in this package. Both modules have a size of only 9.5 × 9.5 × 0.8 mm3. The flip-chip assembly of the CMOS chip on the package is still under fabrication.","PeriodicalId":294862,"journal":{"name":"2011 IEEE MTT-S International Microwave Symposium","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Compact LTCC antenna package for 60 GHz wireless transmission of uncompressed video\",\"authors\":\"S. Brebels, C. Soens, W. De Raedt, G. Vandenbosch\",\"doi\":\"10.1109/MWSYM.2011.5972831\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper proposes a compact antenna package in low-temperature co-fired ceramic (LTCC) technology for 60 GHz wireless transmission of uncompressed video. A 60 GHz active phased-array antenna is realized in the package by integrating 4 open-waveguide antenna elements at the top of the package with a 60 GHz CMOS chip at the bottom of the package. The LTCC build-up was designed to provide low interconnection loss between antenna elements and chip (insertion loss<1 dB), good antenna performance in the full unlicensed 60 GHz band (gain>5.3 dBi) and excellent shielding of the bottom side of the package containing the CMOS chip from the radiation emerging from the top side of the package (>40dB suppression). The low backside radiation allows the direct ball-grid array assembly of the package on a printed circuit-board. Only passive antenna arrays and interconnect lines were fabricated and tested in this paper. Separate transmitter (Tx) and receiver (Rx) modules were also designed in this package. Both modules have a size of only 9.5 × 9.5 × 0.8 mm3. The flip-chip assembly of the CMOS chip on the package is still under fabrication.\",\"PeriodicalId\":294862,\"journal\":{\"name\":\"2011 IEEE MTT-S International Microwave Symposium\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-06-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE MTT-S International Microwave Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2011.5972831\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE MTT-S International Microwave Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2011.5972831","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Compact LTCC antenna package for 60 GHz wireless transmission of uncompressed video
This paper proposes a compact antenna package in low-temperature co-fired ceramic (LTCC) technology for 60 GHz wireless transmission of uncompressed video. A 60 GHz active phased-array antenna is realized in the package by integrating 4 open-waveguide antenna elements at the top of the package with a 60 GHz CMOS chip at the bottom of the package. The LTCC build-up was designed to provide low interconnection loss between antenna elements and chip (insertion loss<1 dB), good antenna performance in the full unlicensed 60 GHz band (gain>5.3 dBi) and excellent shielding of the bottom side of the package containing the CMOS chip from the radiation emerging from the top side of the package (>40dB suppression). The low backside radiation allows the direct ball-grid array assembly of the package on a printed circuit-board. Only passive antenna arrays and interconnect lines were fabricated and tested in this paper. Separate transmitter (Tx) and receiver (Rx) modules were also designed in this package. Both modules have a size of only 9.5 × 9.5 × 0.8 mm3. The flip-chip assembly of the CMOS chip on the package is still under fabrication.