新型三氧化沟槽深栅LDMOS提高自热效应和击穿电压的设计考虑

IF 1 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Iet Circuits Devices & Systems Pub Date : 2021-11-20 DOI:10.1049/cds2.12102
Amir Gavoshani, Ali A. Orouji
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引用次数: 4

摘要

在这项研究中,提出了一种新的器件结构的设计考虑,以提高深栅LDMOS(横向双扩散金属氧化物半导体)晶体管的自热效应(SHE)和击穿电压,并与传统的LDMOS (C-LDMOS)进行了比较。在这种情况下,具有N+沟槽的三氧化物沟槽嵌入在漂移区。这些沟槽在电场剖面中产生额外的峰值,因此电场被修改。作者证明,通过优化沟槽,器件的击穿电压增加。此外,在提出的结构中使用部分埋藏的氧化物来创建传导路径,从而显着降低SHE。此外,与C-LDMOS相比,该器件的导通电阻、晶格温度和击穿电压均有显著提高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Design considerations of a novel Triple Oxide Trench Deep Gate LDMOS to improve self-heating effect and breakdown voltage

In this study, design considerations of a new device structure are presented to improve the self-heating effect (SHE) and the breakdown voltage of the Deep Gate LDMOS (Lateral Double Diffused Metal Oxide Semiconductor) transistor and compared with a conventional LDMOS (C-LDMOS). In this case, triple oxide trenches with an N+ trench are embedded in the drift region. These trenches create additional peaks in the electric field profile, so the electric field is modified. The authors demonstrate that by optimising the trenches, the breakdown voltage of the device increases. Also, a partially buried oxide is used in the proposed structure to create a conduction path that significantly reduces the SHE. Moreover, the results indicate that the specific on-resistance, lattice temperature, and breakdown voltage of the proposed device are improved considerably compared to the C-LDMOS.

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来源期刊
Iet Circuits Devices & Systems
Iet Circuits Devices & Systems 工程技术-工程:电子与电气
CiteScore
3.80
自引率
7.70%
发文量
32
审稿时长
3 months
期刊介绍: IET Circuits, Devices & Systems covers the following topics: Circuit theory and design, circuit analysis and simulation, computer aided design Filters (analogue and switched capacitor) Circuit implementations, cells and architectures for integration including VLSI Testability, fault tolerant design, minimisation of circuits and CAD for VLSI Novel or improved electronic devices for both traditional and emerging technologies including nanoelectronics and MEMs Device and process characterisation, device parameter extraction schemes Mathematics of circuits and systems theory Test and measurement techniques involving electronic circuits, circuits for industrial applications, sensors and transducers
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