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引用次数: 0
摘要
本文首次报道了设计用于300v工作的低损耗、高速IGBT的实测特性。优化后的300 V igbt在电流密度为120 a /cm/sup 2/、结温为150/spl℃时,Vce/sub (sat)/低至1.35 V,下降时间小于20 ns。这种极快的开关导致在150/spl度/C下的E/sub关断小于5 /spl mu/J/A,这与MOSFET相当。IGBT在额定电流下的最大工作频率大于400khz。在高达350 kHz的工作频率下,这些新的300 V igbt比250 V MOSFET具有更低的总损耗。IGBT还针对UIS能力进行了优化,在额定电流下具有超过3 J/cm/sup 2/的单脉冲雪崩能量能力。
In this paper, we report for the first time, the measured characteristics of a low loss, high speed IGBT designed for 300 V operation. The optimized 300 V IGBTs exhibit a low Vce/sub (sat)/ of 1.35 V and an extremely fast fall time of less than 20 ns at a current density of 120 A/cm/sup 2/ and a junction temperature of 150/spl deg/C. This extremely fast switching results in an E/sub off/ of less than 5 /spl mu/J/A at 150/spl deg/C which is comparable to that of a MOSFET. The IGBT has a maximum operating frequency of greater than 400 kHz at rated current. These new 300 V IGBTs exhibit lower total losses than a 250 V MOSFET at operating frequencies as high as 350 kHz. The IGBT is also optimized for UIS capability and has a single pulse avalanche energy capability in excess of 3 J/cm/sup 2/ at rated current.