基于MEMS和nems的复杂自适应智能设备和系统

V. Varadan
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引用次数: 2

摘要

在过去的三十年里,微电子工业经历了爆炸式的增长。逻辑和存储设备的巨大市场推动了新材料的发展,以及制造更复杂设备的技术,这些设备的特征尺寸现在已经降到了亚微米和纳米级别。最近,人们对利用这些材料、工具和技术制造微型传感器和执行器以及将其与电子电路集成以生产智能设备和系统产生了兴趣。这一努力提供了以下承诺:1)通过开发新的批量制造工艺,包括微立体光刻和微成型技术,提高传感器和执行器的性能和可制造性;2)开发以前不可能的新型材料和机械结构,如金刚石样碳、碳化硅和碳纳米管、微型涡轮机和微型发动机;3)纳米级微元件的系统级和晶圆级集成技术的发展,如自组装技术和机器人操作;4)开发MEMS器件的控制和通信系统,如光学和射频无线、电力传输系统等。通过功能化碳纳米管并将其与聚合物基体(如嵌段或接枝共聚物,甚至交联共聚物)化学键合,可以定制出一种新的复合结构,从而赋予其特殊的结构、电子和表面性能。由这种混合复合材料衍生的生物和机械mems器件为未来的智能系统提供了新的途径。
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MEMS- and NEMS-based complex adaptive smart devices and systems
The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with feature sizes now down at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: 1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic and micro molding techniques; 2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; 3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; 4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nanotubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems.
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