{"title":"通过电解降低切削力的微切削。","authors":"M. Nagata, K. Wakabayashi, M. Yamada, T. Masuzawa","doi":"10.2526/JSEME.33.74_24","DOIUrl":null,"url":null,"abstract":"In this paper, we propose a microcutting method with a reduced machining force by applying an electrolytic passive film formation on the workpiece surface. This process realizes the machining of microstructure such as 10μm wide micro grooves which has been difficult to be machined by conventional cutting. A mirror surface which has the roughness 30nm Ry is also obtained by this method.","PeriodicalId":269071,"journal":{"name":"Journal of the Japan Society of Electrical-machining Engineers","volume":"39 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Microcutting with Reduced Cutting Force by Electrolysis.\",\"authors\":\"M. Nagata, K. Wakabayashi, M. Yamada, T. Masuzawa\",\"doi\":\"10.2526/JSEME.33.74_24\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we propose a microcutting method with a reduced machining force by applying an electrolytic passive film formation on the workpiece surface. This process realizes the machining of microstructure such as 10μm wide micro grooves which has been difficult to be machined by conventional cutting. A mirror surface which has the roughness 30nm Ry is also obtained by this method.\",\"PeriodicalId\":269071,\"journal\":{\"name\":\"Journal of the Japan Society of Electrical-machining Engineers\",\"volume\":\"39 3\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-11-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of the Japan Society of Electrical-machining Engineers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2526/JSEME.33.74_24\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of the Japan Society of Electrical-machining Engineers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2526/JSEME.33.74_24","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Microcutting with Reduced Cutting Force by Electrolysis.
In this paper, we propose a microcutting method with a reduced machining force by applying an electrolytic passive film formation on the workpiece surface. This process realizes the machining of microstructure such as 10μm wide micro grooves which has been difficult to be machined by conventional cutting. A mirror surface which has the roughness 30nm Ry is also obtained by this method.
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