Jörg Meyer, Prathamesh Jayant Upasani, Steffen Bickel, I. Panchenko, M. Wolf
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引用次数: 1
摘要
纳米多孔金属间化合物(IMCs)在各种电子元件的三维集成中是一种很有前途的互连选择。这些结合了cu - sn - slip(固液互扩散)互连的高热稳定性和机械稳定性，并大大缩短了加工时间。本文研究了磁通对互连体纳米结构的影响。本文首次报道了Cu$_{\mathbf{3}}$Sn片层网络中Sn的进一步溶解，并对其进行了详细的分析。
Flux-induced porous structures in Cu-SnAg solidliquid-interdiffusion microbump interconnects
Nanoporous intermetallic compounds (IMCs) are a promising option for interconnects in 3D integration of various electronic components. These combine the high thermal and mechanical stability of Cu-Sn-SLID (solid-liquid interdiffusion) interconnects with a strongly reduced processing time. In this paper we address the influence of the flux on the nanostructure of the interconnects. The further dissolution of Sn from the already known lamellar network of Cu$_{\mathbf{3}}$Sn is reported for the first time and analyzed in detail.
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