用于MCM-L/D-和o/e- mcm封装的新型图像化介电和光学材料

M. Robertsson, A. Dabek, G. Gustafsson, O. Hagel, M. Popall
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引用次数: 10

摘要

具有负抗蚀性能的可光制模无机-有机共聚物(或有机改性陶瓷)已被开发和测试为用于电气和/或光学封装目的的薄膜材料,例如MCM- l /D和光电子MCM封装。与聚酰亚胺和苯并环丁烯等替代材料相比,良好的可加工性和更低的固化后温度(120/spl℃-170/spl℃)使得FR-4和BT等低成本玻璃纤维增强聚合物基板具有良好的电学、光学和其他性能。介绍了多层MCM-L/ d的工艺和初步设计规则,并介绍了一些试验车辆,强调了新材料的多功能性和低成本潜力。
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New patternable dielectric and optical materials for MCM-L/D- and o/e-MCM-packaging
Photopatternable inorganic-organic copolymers (ormocers, or organically modified ceramics) with negative resist behaviour have been developed and tested as thin film materials for electrical and/or optical packaging purposes, e.g. MCM-L/D and optoelectronic MCM packaging. Good processability in combination with a much lower post-curing temperature (120/spl deg/C-170/spl deg/C) than alternative materials such as polyimide and benzocyclobutene enables the use of low cost glass fiber reinforced polymer substrates such as FR-4 and BT. The good electrical, optical and other properties are presented and discussed. The process and tentative design-rules for multilayer MCM-L/Ds are described and some test-vehicles are presented, emphasizing the versatility and low-cost potential of the new materials.
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