{"title":"NiSi多晶硅熔断器可靠性在65nm逻辑CMOS技术","authors":"Boon Ang, S. Tumakha, J. Im, S. Paak","doi":"10.1109/IRWS.2006.305218","DOIUrl":null,"url":null,"abstract":"The programming characteristics and reliability of NiSi polysilicon fuse fabricated using 65nm logic CMOS technology were studied. Under optimal programming conditions, high post-program resistance can be achieved. These well programmed fuses showed good data retention, capable of meeting the operating lifetime requirement of most applications","PeriodicalId":199223,"journal":{"name":"2006 IEEE International Integrated Reliability Workshop Final Report","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"NiSi Polysilicon Fuse Reliability in 65nm Logic CMOS Technology\",\"authors\":\"Boon Ang, S. Tumakha, J. Im, S. Paak\",\"doi\":\"10.1109/IRWS.2006.305218\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The programming characteristics and reliability of NiSi polysilicon fuse fabricated using 65nm logic CMOS technology were studied. Under optimal programming conditions, high post-program resistance can be achieved. These well programmed fuses showed good data retention, capable of meeting the operating lifetime requirement of most applications\",\"PeriodicalId\":199223,\"journal\":{\"name\":\"2006 IEEE International Integrated Reliability Workshop Final Report\",\"volume\":\"2015 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 IEEE International Integrated Reliability Workshop Final Report\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRWS.2006.305218\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE International Integrated Reliability Workshop Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.2006.305218","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
NiSi Polysilicon Fuse Reliability in 65nm Logic CMOS Technology
The programming characteristics and reliability of NiSi polysilicon fuse fabricated using 65nm logic CMOS technology were studied. Under optimal programming conditions, high post-program resistance can be achieved. These well programmed fuses showed good data retention, capable of meeting the operating lifetime requirement of most applications