晶圆探测环境中的表面波现象

E. Godshalk
{"title":"晶圆探测环境中的表面波现象","authors":"E. Godshalk","doi":"10.1109/ARFTG.1992.326994","DOIUrl":null,"url":null,"abstract":"Investigation of microwave and millimeter wave propagation in dielectric slabs and along coplanar transmission lines on dielectric slabs, reveal effects that may be explained by surface wave phenomenon. These surface waves can be transmitted and received with wafer probes and influence the transmission characteristics of coplanar transmission lines. This paper presents measured data showing the presence of surface waves and how they interact with wafer probes and coplanar waveguide transmission lines. Methods for minimizing these interactions are explored and quantified. A discussion of surface wave effects on wafer calibrations is included.","PeriodicalId":130939,"journal":{"name":"40th ARFTG Conference Digest","volume":"46 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"28","resultStr":"{\"title\":\"Surface Wave Phenomenon in Wafer Probing Environments\",\"authors\":\"E. Godshalk\",\"doi\":\"10.1109/ARFTG.1992.326994\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Investigation of microwave and millimeter wave propagation in dielectric slabs and along coplanar transmission lines on dielectric slabs, reveal effects that may be explained by surface wave phenomenon. These surface waves can be transmitted and received with wafer probes and influence the transmission characteristics of coplanar transmission lines. This paper presents measured data showing the presence of surface waves and how they interact with wafer probes and coplanar waveguide transmission lines. Methods for minimizing these interactions are explored and quantified. A discussion of surface wave effects on wafer calibrations is included.\",\"PeriodicalId\":130939,\"journal\":{\"name\":\"40th ARFTG Conference Digest\",\"volume\":\"46 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"28\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"40th ARFTG Conference Digest\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ARFTG.1992.326994\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th ARFTG Conference Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARFTG.1992.326994","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 28

摘要

研究了微波和毫米波在介质板中的传播和沿介质板上共面传输线的传播,揭示了表面波现象可以解释的影响。这些表面波可以用晶片探头发射和接收,并影响共面传输线的传输特性。本文给出了显示表面波存在的测量数据,以及它们如何与晶圆探头和共面波导传输线相互作用。探索和量化最小化这些相互作用的方法。讨论了表面波对晶圆校准的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Surface Wave Phenomenon in Wafer Probing Environments
Investigation of microwave and millimeter wave propagation in dielectric slabs and along coplanar transmission lines on dielectric slabs, reveal effects that may be explained by surface wave phenomenon. These surface waves can be transmitted and received with wafer probes and influence the transmission characteristics of coplanar transmission lines. This paper presents measured data showing the presence of surface waves and how they interact with wafer probes and coplanar waveguide transmission lines. Methods for minimizing these interactions are explored and quantified. A discussion of surface wave effects on wafer calibrations is included.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A Frequency Domain Analysis of Multi-Conductor Transmission Line Interconnect Topologies Measuring Package and Interconnect Model Parameters Using Distributed Impedance "Extracting the Required Reflection to Compensate the Sealed Connector of a Microstrip Fixture" Temperature Dependent Characterization of GaAs MESFETs Interconnection Transmission Line Parameter Characterization
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1