{"title":"在300-500℃环境温度下工作的电子设备的热设计的几个方面","authors":"J. Welsh","doi":"10.1109/TANE3.1958.4201633","DOIUrl":null,"url":null,"abstract":"Aspects of electronic part-cooling techniques applicable to 300-500°C equipments are presented. Contrary to some beliefs, the minimization of thermal resistance at these temperatures is as important as at lower temperatures. The significant shifts in the natural modes of heat transfer which occur with high-temperature electronic parts are outlined, together with some recommended methods of cooling high-temperature parts and assemblies.","PeriodicalId":332621,"journal":{"name":"IRE Transactions on Aeronautical and Navigational Electronics","volume":"91 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1958-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Some Aspects of the Thermal Design of Electronic Equipment Operating at 300-500°C Environmental Temperature\",\"authors\":\"J. Welsh\",\"doi\":\"10.1109/TANE3.1958.4201633\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Aspects of electronic part-cooling techniques applicable to 300-500°C equipments are presented. Contrary to some beliefs, the minimization of thermal resistance at these temperatures is as important as at lower temperatures. The significant shifts in the natural modes of heat transfer which occur with high-temperature electronic parts are outlined, together with some recommended methods of cooling high-temperature parts and assemblies.\",\"PeriodicalId\":332621,\"journal\":{\"name\":\"IRE Transactions on Aeronautical and Navigational Electronics\",\"volume\":\"91 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1958-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IRE Transactions on Aeronautical and Navigational Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TANE3.1958.4201633\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IRE Transactions on Aeronautical and Navigational Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TANE3.1958.4201633","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Some Aspects of the Thermal Design of Electronic Equipment Operating at 300-500°C Environmental Temperature
Aspects of electronic part-cooling techniques applicable to 300-500°C equipments are presented. Contrary to some beliefs, the minimization of thermal resistance at these temperatures is as important as at lower temperatures. The significant shifts in the natural modes of heat transfer which occur with high-temperature electronic parts are outlined, together with some recommended methods of cooling high-temperature parts and assemblies.