热化学气相沉积法制备氮化非晶碳膜

F. Mohamad, M. Rusop
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引用次数: 0

摘要

对750℃下沉积的非晶碳(a-C)薄膜和氮化非晶碳(a-C:N)薄膜的电学性能和结构性能进行了比较。采用热化学气相沉积(TCVD)技术分别以氩气(Ar)、氮气(N2)和樟脑油为载气、掺杂剂和碳源沉积这些薄膜。电学和结构表征基于Advantest R6243直流电压电流源/监视器和SemiPro曲线软件和扫描电子显微镜(SEM)。由于氮原子的排列,a-C和a-C:N薄膜的电学性能和表面形貌发生了显著的变化。
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Nitrogenated amorphous carbon film by thermal chemical vapor deposition
The comparison in term of both electrical and structural properties of amorphous carbon (a-C) thin film and nitrogenated amorphous carbon (a-C:N) thin film deposited at 750 °C has been done. The deposition of those films by thermal chemical vapour deposition (TCVD) technique involved argon (Ar) gas, nitrogen gas (N2) and camphor oil as carrier gas, dopant and carbon source respectively. The electrical and structural characterizations were based on Advantest R6243 DC Voltage Current Source/Monitor and SemiPro Curve Software and Scanning Electron Microscopy (SEM). There are significant changes in electrical properties and surface morphology for a-C and a-C:N thin films due to the arrangement of nitrogen atoms.
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