局部金属掺杂对taox基RRAM器件开关行为的影响

Zongwei Wang, Jian Kang, Yichen Fang, Zhizhen Yu, Xue Yang, Yimao Cai, Yangyuan Wang, Ru Huang
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引用次数: 11

摘要

存储单元,特别是非易失性存储器(NVM)是高性能电子系统中不可缺少的部件,其目的是实现高效的信息处理和存储。电阻式随机存取存储器(RRAM)是新兴存储技术中最有前途的一种。然而,由于细丝形成的内在随机性所带来的可变性的优化仍然是一个棘手的问题。在本文中,与均匀掺杂器件相比,局部掺杂器件的工作电压和工作电阻的均匀性都有了明显的提高,这可以归因于局部掺杂而非均匀掺杂进一步破坏了随机性。
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Localized metal doping effect on switching behaviors of TaOx-based RRAM device
Memory unit, especially the non-volatile memory (NVM), is an indispensable component in a high performance electronic systems which aims at efficient information processing and storage. Resistive random access memory (RRAM) is one of the most promising candidates among the emerging memory technologies. However, optimization of the variability introduced by the intrinsic stochastic nature of filament formation remains a tough problem. In this paper, both operation voltage and resistance of the device with localized implantation show significant improvement of uniformity compared with uniformly doped device, which can be attributed to the further undermine of the randomness due to localized doping instead of uniformly doping.
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