封装惯性系统

2016 IEEE International Electron Devices Meeting (IEDM) Pub Date : 2016-12-01 DOI:10.1109/IEDM.2016.7838484

C. Ahn, D. L. Christensen, D. Heinz, V. Hong, E. Ng, Janna Rodriguez, Yushi Yang, G. O'brien, T. Kenny

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引用次数: 2

摘要

人们对将多个MEMS功能集成到单个紧凑器件中非常感兴趣。我们的团队开发了一种晶圆级封装工艺，为MEMS时序参考器件的运行提供了超清洁、稳定的环境，该工艺已被SiTime公司商业化。在本文中，我们讨论了一些与惯性传感器纳入该封装过程相关的问题，包括设计约束，粘滞，压力和其他问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Encapsulated inertial systems

There is significant interest in integration of multiple MEMS functionalities into a single compact device. Our group has developed a wafer-scale encapsulation process that provides an ultraclean, stable environment for operation of MEMS timing references, which has been commercialized by SiTime, Inc. In this paper, we discuss some of the issues associated with incorporation of inertial sensors into this encapsulation process, including design constraints, stiction, pressure, and other issues.

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2016 IEEE International Electron Devices Meeting (IEDM)

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