纳米级FinFET器件和电路的总电离剂量和辐射粒子冲击分析

C. Spoorthi, Jessy Grace, A. Chavan, C. S. M. Rao
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引用次数: 1

摘要

本文研究了所设计的纳米级器件和电路在高能粒子照射下的二维和三维结构的操作稳健性和设计可靠性。在使用GDS2MESH工具生成的22nm FinFET器件上进行TID分析。本文提出了一种粒子撞击模拟方法,通过改变线性能量转移(LET)值从10MeV到200Mev,来了解22nm FinFET SRAM电路三维结构中的电离电荷分布和识别脆弱节点。该研究有助于验证电路的物理结构,以减轻粒子撞击的影响。在存储单元中,识别和保护脆弱节点以隔离电离引起的电荷分布。
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Total Ionizing Dose and Radiation Particle Strike Analysis of Nanoscale FinFET Devices and Circuits
The proposed work investigates the operational robustness and design reliability of 2D and 3D structures of the designed nano-scale devices and circuits, when irradiated by high-energy particles. The TID analysis are performed on 22nm FinFET devices, which is generated by using GDS2MESH tool. The paper presents a methodology for particle strike simulation to understand the ionization charge distribution and identify the vulnerable nodes in the 3D structure of a 22nm FinFET SRAM circuit by varying the Linear Energy Transfer (LET) values from 10MeV to 200Mev. This study is useful in validating the physical structure of a circuit in mitigating the effects of particle strike. In case of memory cell the vulnerable nodes are identified and guarded to isolate the charge distribution due to ionization.
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