{"title":"LTCC技术制造3D电阻器的可能性","authors":"M. Klíma, I. Szendiuch","doi":"10.1109/ISSE.2012.6273107","DOIUrl":null,"url":null,"abstract":"The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers - directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"142 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Possibilities of making 3D resistors in LTCC technology\",\"authors\":\"M. Klíma, I. Szendiuch\",\"doi\":\"10.1109/ISSE.2012.6273107\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers - directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.\",\"PeriodicalId\":277579,\"journal\":{\"name\":\"2012 35th International Spring Seminar on Electronics Technology\",\"volume\":\"142 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-05-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 35th International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2012.6273107\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2012.6273107","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Possibilities of making 3D resistors in LTCC technology
The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers - directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.
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