Hasnida Abdul Samat, S. Kamaruddin, Ishak Abd Azid
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Copper bonding has received attention because of its low cost, high electrical conductivity and resistance to wire sweep during plastic encapsulation. However, copper have hard properties thus more care is required during bonding as to avoid cratering problem. With the situation, this paper was written to find and analyze machine failure using Failure Mode and Effect Analysis (FMEA) technique to verify machine capability and problems faced when operating using Copper wire. Furthermore, general approach for improvement plan based on type of failure and failure causes are presented as conducted in a semiconductor company in Malaysia. 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引用次数: 3
摘要
在像半导体制造业这样快速变化和竞争激烈的行业中,可靠性或故障概率一直是涉及机器和设备的任何过程和操作的关键部分。电线键合工艺是众多电子制造技术之一,由于市场对小型电子产品的需求快速变化,因此需要灵活而精确的技术。钢丝粘合过程的性质非常微妙,通常在这种类型的操作中发生的任何故障有时都不会被注意到,这种情况会使公司损失一大笔钱。本文的目的是根据铜线焊线过程中出现的故障来讨论设备的可靠性。铜键合因其成本低、电导率高、耐塑料封装过程中的导线扫线等优点而受到人们的关注。然而,铜具有较硬的性质,因此在连接过程中需要更加小心,以避免出现凹坑问题。针对这种情况,本文采用故障模式与影响分析(failure Mode and Effect Analysis, FMEA)技术对机器故障进行发现和分析,验证机器在使用铜线操作时的能力和面临的问题。此外,提出了在马来西亚一家半导体公司进行的基于故障类型和故障原因的改进计划的一般方法。研究结果表明,故障分析是了解机械性能和可靠性的一项重要工作。
Failure analysis for Copper Wire Bonding process from machine perspective
In fast changing and very competitive industry like semiconductor manufacturing, reliability or probability of failure always has been a crucial part in any processes and operation involving machine and equipment. One of many electronic manufacturing technologies is Wire Bond process, which entails a flexible and an accurate technology because of fast changing market demand for smaller electronic gadgets. Nature of wire bond process which is very delicate, usually makes any failures happen during this type of operation goes unnoticed for sometimes and this situation will cost the company a fortune. This paper aims to discuss equipment reliability based on failure occurrences in wire bond process using copper wire. Copper bonding has received attention because of its low cost, high electrical conductivity and resistance to wire sweep during plastic encapsulation. However, copper have hard properties thus more care is required during bonding as to avoid cratering problem. With the situation, this paper was written to find and analyze machine failure using Failure Mode and Effect Analysis (FMEA) technique to verify machine capability and problems faced when operating using Copper wire. Furthermore, general approach for improvement plan based on type of failure and failure causes are presented as conducted in a semiconductor company in Malaysia. The finding of the study provides evidence that failure analysis is an important task to be done in order to understand machine capability and reliability.