{"title":"目前的现状是以层压板为主，模压型MCM技术","authors":"P.E. Rogren","doi":"10.1109/IEMT.1993.398158","DOIUrl":null,"url":null,"abstract":"Laminate technology has progressed to the point where it is capable of producing multichip module (MCM) substrates that can compete favorably with both cofire ceramic and thin film. By virtue of the properties of the materials set and flexibility of the process, laminate based MCM offer superior electrical performance. Laminates can be expected to be faster than either cofire ceramic or thin film and will be significantly less noise than ceramic based MCMs. In terms of thermal performance, several levels of thermal enhancements available on laminate substrates keep pace with similar methods available for ceramic or metal packages.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"266 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The current state of laminate based, molded MCM technology\",\"authors\":\"P.E. Rogren\",\"doi\":\"10.1109/IEMT.1993.398158\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Laminate technology has progressed to the point where it is capable of producing multichip module (MCM) substrates that can compete favorably with both cofire ceramic and thin film. By virtue of the properties of the materials set and flexibility of the process, laminate based MCM offer superior electrical performance. Laminates can be expected to be faster than either cofire ceramic or thin film and will be significantly less noise than ceramic based MCMs. In terms of thermal performance, several levels of thermal enhancements available on laminate substrates keep pace with similar methods available for ceramic or metal packages.<<ETX>>\",\"PeriodicalId\":206206,\"journal\":{\"name\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"volume\":\"266 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1993.398158\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.398158","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The current state of laminate based, molded MCM technology
Laminate technology has progressed to the point where it is capable of producing multichip module (MCM) substrates that can compete favorably with both cofire ceramic and thin film. By virtue of the properties of the materials set and flexibility of the process, laminate based MCM offer superior electrical performance. Laminates can be expected to be faster than either cofire ceramic or thin film and will be significantly less noise than ceramic based MCMs. In terms of thermal performance, several levels of thermal enhancements available on laminate substrates keep pace with similar methods available for ceramic or metal packages.<>
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