{"title":"IC封装的热建模","authors":"A. Fodor, R. Jano","doi":"10.1109/SIITME.2013.6743662","DOIUrl":null,"url":null,"abstract":"The presented work analyses the effect of the IC package on heat dissipation. Thermal simulations of three types of IC packaging have been carried out. DIP-28, TQFP-32 and MLF-32 packaging models have been implemented in SolidWorks 2012 and their efficiency in evacuating heat has been evaluated and compared. Natural cooling was investigated in an open environment and investigations in closed spaces and with forced cooling applied were made. The research focuses on accurately modelling electronic packaging of integrated components.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal modelling of IC packages\",\"authors\":\"A. Fodor, R. Jano\",\"doi\":\"10.1109/SIITME.2013.6743662\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The presented work analyses the effect of the IC package on heat dissipation. Thermal simulations of three types of IC packaging have been carried out. DIP-28, TQFP-32 and MLF-32 packaging models have been implemented in SolidWorks 2012 and their efficiency in evacuating heat has been evaluated and compared. Natural cooling was investigated in an open environment and investigations in closed spaces and with forced cooling applied were made. The research focuses on accurately modelling electronic packaging of integrated components.\",\"PeriodicalId\":267846,\"journal\":{\"name\":\"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"volume\":\"103 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SIITME.2013.6743662\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIITME.2013.6743662","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The presented work analyses the effect of the IC package on heat dissipation. Thermal simulations of three types of IC packaging have been carried out. DIP-28, TQFP-32 and MLF-32 packaging models have been implemented in SolidWorks 2012 and their efficiency in evacuating heat has been evaluated and compared. Natural cooling was investigated in an open environment and investigations in closed spaces and with forced cooling applied were made. The research focuses on accurately modelling electronic packaging of integrated components.
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