采用0.18 μm CMOS片上电感，非接触式10%高效36mW功率输出

2007 IEEE Asian Solid-State Circuits Conference Pub Date : 2007-11-01 DOI:10.1109/ASSCC.2007.4425745

Yuan Yuxiang, Y. Yoshida, T. Kuroda

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引用次数: 28

摘要

本文介绍了一种0.18 μ m CMOS工艺中堆叠芯片间电感耦合功率传输系统的设计与实现。比较了两种传统的大功率整流器结构，提出了一种新的拓扑结构。采用一对完全优化的700 μ m × 700 μ m片上电感，测试芯片达到10%的峰值效率和36 mW的功率传输。与之前发布的片对片无线电力传输系统相比，接收功率提高了13倍。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS

This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-mum CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700 mum times 700 mum on-chip inductors, the test chip achieves 10% peak efficiency and 36 mW power transmission. Compared with previous published chip-to-chip wireless power transmission systems, the received power is 13 times larger.

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2007 IEEE Asian Solid-State Circuits Conference

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