FlashSoldering update-extending fine magnet wire joining applications

FlashSoldering was first developed in 1998 as a new innovative, non-contact, localized reflow soldering process for terminating fine insulated copper magnet wires to electronic contacts without first removing the wire insulation. Subsequent research in 1999 has extended FlashSoldering applications from miniature magnetic component packages to soldering insulated single and multiple magnet wires and Litz wire to high-speed data connectors and other forms of electronic contacts. Quality issues concerned with copper-tin intermetallic growth and what happens to the magnet wire insulation during FlashSoldering were successfully resolved. Applications for FlashSoldering have broadened to include: single and multiple toroidal transformer packaging; LAN filters; low power DC-DC converters; single or multiple form coils and inductors; woven or braided high speed data cables; and connecting a single wire to a Litz wire bundle.