封装对功率mosfet雪崩额定值的影响

E. McShane, K. Shenai
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引用次数: 1

摘要

器件雪崩额定值是比较封装部件的常用指标。额定值已被证明受到内部热动力学的影响。这些动态会受到封装热性能的影响。研究了封装热性能对雪崩额定值的影响,并给出了雪崩电流的紧凑解析表达式。
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Package effects on avalanche rating of power MOSFETs
Device avalanche rating is a common figure of merit for comparing packaged parts. The rating has been shown to be affected by internal thermal dynamics. These dynamics can be influenced by the package thermal properties. The effect of package thermal performance on avalanche rating is investigated and a compact analytical expression to obtain the avalanche current is described.
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