Hybrid gate dielectric with Si3N4 stressor for LDMOSFET

Lateral double diffused MOSFET (LDMOSFET) with Stress engineering has been explored in this work with a calibrated Silicon (Si) simulation deck. Silicon Nitride (Si3N4) layer having intrinsic stress has been used to generate stress in the device. Hybrid gate dielectric with Silicon dioxide (SiO2) and the Si3N4 is used in this study. With the help of simulations (Process, Device and Mixed-mode), we observe the drain current improvement of 6%, decrease in terminal capacitance and specific on-resistance (Ron,sp) and increase in the transition frequency. This method can supplement the existing performance improvement techniques for an LDMOSFET device.