全ECL兼容高速逻辑集成电路的稳定性和可靠性研究。

Y. Hosono, H. Sato, Y. Mira, S. Ichikawa, H. Hirayama, K. Katsukawa, K. Ueda, K. Uetake, T. Noguchi, H. Kohzu
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引用次数: 1

摘要

对新开发的高速砷化镓逻辑集成电路的电气特性、稳定性和可靠性进行了研究。采用电阻负载源耦合场效应管逻辑(SCFL)作为基本电路结构。采用选择性外延生长的n/sup +/ - GaAs层作为WSi自对准栅场效应管的接触区。这些器件的最大工作数据速率超过2.6 Gb/s,保证了足够的供电电压和相位裕度。在3000小时的直流偏置测试和7000小时的2gb /s射频操作测试中未观察到故障。
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Stability and Reliability Investigation on Fully ECL Compatible High Speed- Logic ICs.
The electrical characteristics stability and reliability were investigated on newly developed high speed GaAs logic ICS. A resistor-loaded source-coupled FET logic (SCFL) was employed as a basic circuit architecture. The selectively epitaxial grown n/sup +/ - GaAs layers were aclopted for the contact regions of the WSi self-aligned gate FET. Maximum operating data rate of more than 2.6 Gb/s was achieved in these devices, guaranteeing sufficient supply voltage and phase margin. No failure has been observed in DC bias test for 3,000 hours and in RF operational test at 2 Gb/s for 7,000 hours.
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