{"title":"集成EOP/EOFM作为开放通孔/触点的互补定位技术","authors":"Nutthapon Jandee, Damrong Korbsrisawat, Ferdie Paulino","doi":"10.1109/IPFA.2018.8452501","DOIUrl":null,"url":null,"abstract":"The paper describes as integrated technique of Electro Optical Frequency Mapping (EOFM) and Electro Optical Probing (EOP) to localize open failure mode with traditional FA analysis approach. The technique was performed in analog devices on advanced SOI-based circuits. Two case studies were presented to demonstrate on how the newly introduced fault localization techniques work. These techniques can help to isolate or narrow down the suspected failing components.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Integrating EOP/EOFM as a Complimentary Localization Technique for Open Via/Contact\",\"authors\":\"Nutthapon Jandee, Damrong Korbsrisawat, Ferdie Paulino\",\"doi\":\"10.1109/IPFA.2018.8452501\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper describes as integrated technique of Electro Optical Frequency Mapping (EOFM) and Electro Optical Probing (EOP) to localize open failure mode with traditional FA analysis approach. The technique was performed in analog devices on advanced SOI-based circuits. Two case studies were presented to demonstrate on how the newly introduced fault localization techniques work. These techniques can help to isolate or narrow down the suspected failing components.\",\"PeriodicalId\":382811,\"journal\":{\"name\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"65 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2018.8452501\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452501","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integrating EOP/EOFM as a Complimentary Localization Technique for Open Via/Contact
The paper describes as integrated technique of Electro Optical Frequency Mapping (EOFM) and Electro Optical Probing (EOP) to localize open failure mode with traditional FA analysis approach. The technique was performed in analog devices on advanced SOI-based circuits. Two case studies were presented to demonstrate on how the newly introduced fault localization techniques work. These techniques can help to isolate or narrow down the suspected failing components.
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