VLSI电路优化设计与可制造性的统计参数控制

M. Bolt, J. Engel, C.L.M. v.d. Klauw, M. Rocchi
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引用次数: 8

摘要

基于不相关的几何和温度无关的设计参数组,开发了VLSI产品的一阶统计最坏情况设计方法。通过将在线SPC(统计过程控制)扩展到PCM结果,对生产中的参数进行统计监控。通过对参数窗口内的性能参数进行完整的灵敏度分析(包括二阶项和必要时的交叉项),确定了设计参数的关键组。然后,从灵敏度分析的结果可以很容易地推导出3西格玛性能极限的估计。不相关的几何和温度无关的设计参数组已被发现是过程和设计之间的最佳接口,使统计设计以非常经济有效的方式成为可能。基于高速1.2 μ m 64 K CMOS SRAM的研制和生产数据,讨论了该方法的实验验证。
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Statistical parameter control for optimum design and manufacturability of VLSI circuits
A first-order statistical worst-case design methodology for VLSI products that is based on uncorrelated groups of geometry- and temperature-independent design parameters has been developed. The parameters are statistically monitored in production by extending in-line SPC (statistical process control) to PCM results. Key groups of design parameters are identified by means of a complete sensitivity analysis (including second-order terms and cross terms if necessary) on the performance parameters within the parameter windows. An estimate of the 3- sigma performance limits is then readily derived from the results of the sensitivity analysis. The uncorrelated groups of geometry- and temperature-independent design parameters have been found to be an optimum interface between process and design, making statistical design possible in a very cost-effective way. Experimental qualification of the method is discussed based on development and production data of a high-speed 1.2- mu m 64 K CMOS SRAM.<>
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