能量色散x射线微分析中电子穿透与束流加速电压的关系研究

S. Lee, H. Younan, Z. Siping, Mo Zhi-qiang
{"title":"能量色散x射线微分析中电子穿透与束流加速电压的关系研究","authors":"S. Lee, H. Younan, Z. Siping, Mo Zhi-qiang","doi":"10.1109/SMELEC.2006.380704","DOIUrl":null,"url":null,"abstract":"Energy-dispersive X-ray microanalysis technique has been commonly used in failure analysis. It is vital for an analyst to understand the electron penetration depth in a certain material so as to be able to select an appropriate accelerating beam voltage. In this paper, we will use the Monte Carlo electron flight simulation method to obtain the electron penetration data at the different beam acceleration voltages of 5 kV, 10 kV, 15 kV, 20 kV, 25 kV and 30 kV for the various possible elements/materials in wafer fabrication.","PeriodicalId":136703,"journal":{"name":"2006 IEEE International Conference on Semiconductor Electronics","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2006-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Studies on Electron Penetration Versus Beam Acceleration Voltage in Energy-Dispersive X-Ray Microanalysis\",\"authors\":\"S. Lee, H. Younan, Z. Siping, Mo Zhi-qiang\",\"doi\":\"10.1109/SMELEC.2006.380704\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Energy-dispersive X-ray microanalysis technique has been commonly used in failure analysis. It is vital for an analyst to understand the electron penetration depth in a certain material so as to be able to select an appropriate accelerating beam voltage. In this paper, we will use the Monte Carlo electron flight simulation method to obtain the electron penetration data at the different beam acceleration voltages of 5 kV, 10 kV, 15 kV, 20 kV, 25 kV and 30 kV for the various possible elements/materials in wafer fabrication.\",\"PeriodicalId\":136703,\"journal\":{\"name\":\"2006 IEEE International Conference on Semiconductor Electronics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 IEEE International Conference on Semiconductor Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMELEC.2006.380704\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE International Conference on Semiconductor Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMELEC.2006.380704","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

摘要

能量色散x射线微分析技术是失效分析中常用的技术。为了能够选择合适的加速束电压,分析人员了解电子在某种材料中的穿透深度是至关重要的。在本文中,我们将使用蒙特卡罗电子飞行模拟方法来获得不同的电子束加速电压(5 kV、10 kV、15 kV、20 kV、25 kV和30 kV)下晶圆制造中各种可能的元件/材料的电子穿透数据。
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Studies on Electron Penetration Versus Beam Acceleration Voltage in Energy-Dispersive X-Ray Microanalysis
Energy-dispersive X-ray microanalysis technique has been commonly used in failure analysis. It is vital for an analyst to understand the electron penetration depth in a certain material so as to be able to select an appropriate accelerating beam voltage. In this paper, we will use the Monte Carlo electron flight simulation method to obtain the electron penetration data at the different beam acceleration voltages of 5 kV, 10 kV, 15 kV, 20 kV, 25 kV and 30 kV for the various possible elements/materials in wafer fabrication.
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