Thomas W. Hart, Durrell W. Hillis, J. Marley, R. C. Lutz, C. R. Hoffman
{"title":"用于第四代计算机的主框架半导体存储器","authors":"Thomas W. Hart, Durrell W. Hillis, J. Marley, R. C. Lutz, C. R. Hoffman","doi":"10.1145/1478559.1478616","DOIUrl":null,"url":null,"abstract":"It has been obvious for several years that Large Scale Integration could be applied to memories. Memories offer several advantages in that a large volume of one type of device can be manufactured, and that the design can be optimized for one application. There exists a wide spectrum of memory product areas with varying size, costs, speed and enviromental performance. Most of these application areas are presently serviced by various forms of magnetic storage.","PeriodicalId":230827,"journal":{"name":"AFIPS '69 (Fall)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1969-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"A main frame semiconductor memory for fourth generation computers\",\"authors\":\"Thomas W. Hart, Durrell W. Hillis, J. Marley, R. C. Lutz, C. R. Hoffman\",\"doi\":\"10.1145/1478559.1478616\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It has been obvious for several years that Large Scale Integration could be applied to memories. Memories offer several advantages in that a large volume of one type of device can be manufactured, and that the design can be optimized for one application. There exists a wide spectrum of memory product areas with varying size, costs, speed and enviromental performance. Most of these application areas are presently serviced by various forms of magnetic storage.\",\"PeriodicalId\":230827,\"journal\":{\"name\":\"AFIPS '69 (Fall)\",\"volume\":\"60 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1969-11-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"AFIPS '69 (Fall)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/1478559.1478616\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"AFIPS '69 (Fall)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1478559.1478616","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A main frame semiconductor memory for fourth generation computers
It has been obvious for several years that Large Scale Integration could be applied to memories. Memories offer several advantages in that a large volume of one type of device can be manufactured, and that the design can be optimized for one application. There exists a wide spectrum of memory product areas with varying size, costs, speed and enviromental performance. Most of these application areas are presently serviced by various forms of magnetic storage.