用于第四代计算机的主框架半导体存储器

Thomas W. Hart, Durrell W. Hillis, J. Marley, R. C. Lutz, C. R. Hoffman
{"title":"用于第四代计算机的主框架半导体存储器","authors":"Thomas W. Hart, Durrell W. Hillis, J. Marley, R. C. Lutz, C. R. Hoffman","doi":"10.1145/1478559.1478616","DOIUrl":null,"url":null,"abstract":"It has been obvious for several years that Large Scale Integration could be applied to memories. Memories offer several advantages in that a large volume of one type of device can be manufactured, and that the design can be optimized for one application. There exists a wide spectrum of memory product areas with varying size, costs, speed and enviromental performance. Most of these application areas are presently serviced by various forms of magnetic storage.","PeriodicalId":230827,"journal":{"name":"AFIPS '69 (Fall)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1969-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"A main frame semiconductor memory for fourth generation computers\",\"authors\":\"Thomas W. Hart, Durrell W. Hillis, J. Marley, R. C. Lutz, C. R. Hoffman\",\"doi\":\"10.1145/1478559.1478616\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It has been obvious for several years that Large Scale Integration could be applied to memories. Memories offer several advantages in that a large volume of one type of device can be manufactured, and that the design can be optimized for one application. There exists a wide spectrum of memory product areas with varying size, costs, speed and enviromental performance. Most of these application areas are presently serviced by various forms of magnetic storage.\",\"PeriodicalId\":230827,\"journal\":{\"name\":\"AFIPS '69 (Fall)\",\"volume\":\"60 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1969-11-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"AFIPS '69 (Fall)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/1478559.1478616\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"AFIPS '69 (Fall)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1478559.1478616","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

摘要

几年来,大规模集成技术应用于记忆领域的前景已经很明显。存储器有几个优点,可以制造大量的一种类型的器件,并且可以针对一种应用优化设计。存储器产品的种类繁多,尺寸、成本、速度和环保性能各不相同。目前,这些应用领域中的大多数都由各种形式的磁存储器提供服务。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A main frame semiconductor memory for fourth generation computers
It has been obvious for several years that Large Scale Integration could be applied to memories. Memories offer several advantages in that a large volume of one type of device can be manufactured, and that the design can be optimized for one application. There exists a wide spectrum of memory product areas with varying size, costs, speed and enviromental performance. Most of these application areas are presently serviced by various forms of magnetic storage.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
MOBSSL-UAF: an augmented block structured continuous system simulation language for digital and hybrid computers Computer microfilm: a cost cutting solution to the EDP output bottleneck The extended space technique for hybird computer solution of partial differential equations A consideration of the application of cryptographic techniques to data processing A new integrated magnetic memory
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1