实现异构集成的器件嵌入式衬底技术

{"title":"实现异构集成的器件嵌入式衬底技术","authors":"Henry H. Utsunomiya","doi":"10.5104/jiep.26.634","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Device-Embedded Substrate Technology to Implement Heterogeneous Integration\",\"authors\":\"Henry H. Utsunomiya\",\"doi\":\"10.5104/jiep.26.634\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":38475,\"journal\":{\"name\":\"Journal of Japan Institute of Electronics Packaging\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Japan Institute of Electronics Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.5104/jiep.26.634\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Japan Institute of Electronics Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.5104/jiep.26.634","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}