不同交联度双层有机硅凝胶的电树现象及其介电强度

Risa Kuroda, Hyeon-Gu Jeon, Haruo Ihori
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摘要

硅凝胶广泛用于封装电源模块,对其介电强度的提高提出了要求。因此,我们的研究目的是为了提高硅凝胶封装剂的介电强度,我们重点研究了硅凝胶的交联度。以往的研究表明,电树的生长机制随着硅胶交联程度的不同而变化。这表明不同交联程度的界面存在抑制树木生长的可能性。本文研究了硅凝胶-交联度梯度层材料的树形生长和击穿特性。在我们的研究中,界面被布置成垂直于电力线。结果表明,不同交联度界面的势垒效应和低交联度区域电场的弛豫延缓了树的生长,从而提高了树的介电强度。
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Electrical Treeing Phenomena in Two-Layer Silicone Gel with Different Crosslinking Degrees and its Dielectric Strength
Silicone gel is widely used to encapsulate power modules, and improvement of its dielectric strength has been required. So, the purpose of our research is to improve dielectric strength of silicone gel encapsulant, and we focus on crosslinking degree of silicone gel. Previous studies have shown that growth mechanism of electrical tree changes with crosslinking degree of silicone gel. This suggests the possibility that the presence of the interface by different crosslinking degrees inhibits the tree growth. In this paper, we have investigated the tree growth and breakdown characteristics in silicone gel - crosslinking degrees graded layer materials. The interfaces in our study are arrange as being vertical to the line of electric force. Consequently, it was clarified that barrier effect of interface by different crosslinking degrees and the relaxation of electric field in low crosslinking degree region retards on tree growth, which improves the dielectric strength.
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