基于二维半导体的场效应晶体管:回顾主要的里程碑和挑战

IF 1.9 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Frontiers in electronics Pub Date : 2023-11-08 DOI:10.3389/felec.2023.1277927
Keshari Nandan, Amit Agarwal, Somnath Bhowmick, Yogesh S. Chauhan
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引用次数: 0

摘要

二维(2-D)半导体正在成为未来埃斯特罗姆技术节点的有力竞争者。与传统的大块半导体(如Si、Ge和III-V化合物)相比,它们的潜力在于增强的器件缩放和节能开关。这些材料具有显著的优势,特别是在原子级厚度的超薄设备中。其独特的结构使一维纳米带和垂直和横向异质结构的创建成为可能。这种设计上的多功能性,加上它们独特的特性,为电子设备中高效的能量转换铺平了道路。此外,二维半导体提供了将金属纳米带、碳纳米管(CNT)和石墨烯与其二维通道材料集成的机会。这种集成有助于克服光刻工艺对栅极图案的限制,从而实现超短栅极尺寸。考虑到这些因素,二维半导体在电子领域的潜力是巨大的。本文简要介绍了二维逻辑器件的最新进展和工程策略。
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Two-dimensional semiconductors based field-effect transistors: review of major milestones and challenges
Two-dimensional (2-D) semiconductors are emerging as strong contenders for the future of Angstrom technology nodes. Their potential lies in enhanced device scaling and energy-efficient switching compared to traditional bulk semiconductors like Si, Ge, and III-V compounds. These materials offer significant advantages, particularly in ultra-thin devices with atomic scale thicknesses. Their unique structures enable the creation of one-dimensional nanoribbons and vertical and lateral heterostructures. This versatility in design, coupled with their distinctive properties, paves the way for efficient energy switching in electronic devices. Moreover, 2-D semiconductors offer opportunities for integrating metallic nanoribbons, carbon nanotubes (CNT), and graphene with their 2-D channel materials. This integration helps overcome lithography limitations for gate patterning, allowing the realization of ultra-short gate dimensions. Considering these factors, the potential of 2-D semiconductors in electronics is vast. This concise review focuses on the latest advancements and engineering strategies in 2-D logic devices.
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