基于广义学习系统的铣削表面粗糙度分类与检测

IF 1 4区 工程技术 Q4 INSTRUMENTS & INSTRUMENTATION Metrology and Measurement Systems Pub Date : 2023-11-06 DOI:10.24425/mms.2022.142268
Runji Fang, Huaian Yi, Shuai Wang, Yilun Niu
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Classification and inspection of milling surface roughness based on a broad learning system
Current vision-based roughness measurement methods are classified into two main types: index design and deep learning. Among them, the computation procedure for constructing a roughness correlation index based on image data is relatively difficult, and the imaging environment criteria are stringent and not universally applicable. The roughness measurement method based on deep learning takes a long time to train the model, which is not conducive to achieving rapid online roughness measurement. To tackle with the problems mentioned above, a visual measurement method for surface roughness of milling workpieces based on broad learning system was proposed in this paper. The process began by capturing photos of the milling workpiece using a CCD camera in a normal lighting setting. Then, the train set was augmented with additional data to lower the quantity of data required by the model. Finally, the broad learning system was utilized to achieve the classification prediction of roughness. The experimental results showed that the roughness measurement method in this paper not only had a training speed incomparable to deep learning models, but also could automatically extract features and exhibited high recognition accuracy.
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来源期刊
Metrology and Measurement Systems
Metrology and Measurement Systems INSTRUMENTS & INSTRUMENTATION-
CiteScore
2.00
自引率
10.00%
发文量
0
审稿时长
6 months
期刊介绍: Contributions are invited on all aspects of the research, development and applications of the measurement science and technology. The list of topics covered includes: theory and general principles of measurement; measurement of physical, chemical and biological quantities; medical measurements; sensors and transducers; measurement data acquisition; measurement signal transmission; processing and data analysis; measurement systems and embedded systems; design, manufacture and evaluation of instruments. The average publication cycle is 6 months.
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