采用有限元法研究了材料梯度对层状功能梯度材料板静动力响应的影响

IF 1.2 4区 工程技术 Q3 ENGINEERING, MULTIDISCIPLINARY Bulletin of the Polish Academy of Sciences-Technical Sciences Pub Date : 2023-11-06 DOI:10.24425/bpasts.2019.130191
N. Vasiraja, P. Nagaraj
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The effect of material gradient on the static and dynamic response of layered functionally graded material plate using finite element method
This article focuses on the finite element analysis (FEA) of the nonlinear behavior of a layered functionally graded material (FGM) plate as concerns displacement, stresses, critical buckling load and fundamental frequency. The material properties of each layer in an FGM plate are assessed according to a ceramic based simple power law distribution and the rules of mixture. The finite element model of a layered FGM plate is developed using ANSYS®15.0 software. The developed finite element model is used to study the static and dynamic responses of an FGM plate. In this paper, the effects of power law distribution, thickness ratio, aspect ratio and boundary conditions are investigated for central displacement, transverse shear stress, transverse normal stress, critical buckling load and fundamental frequency, and the obtained FEA results are in sound agreement with the literature test data results. Since the FGM is used in a high temperature environment, the FE analysis is performed for the FGM plate under a thermal field and then correlated. Finally, the FGM plate is analyzed under a thermomechanical load by using the current FE concept.
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来源期刊
CiteScore
2.80
自引率
16.70%
发文量
0
审稿时长
6-12 weeks
期刊介绍: The Bulletin of the Polish Academy of Sciences: Technical Sciences is published bimonthly by the Division IV Engineering Sciences of the Polish Academy of Sciences, since the beginning of the existence of the PAS in 1952. The journal is peer‐reviewed and is published both in printed and electronic form. It is established for the publication of original high quality papers from multidisciplinary Engineering sciences with the following topics preferred: Artificial and Computational Intelligence, Biomedical Engineering and Biotechnology, Civil Engineering, Control, Informatics and Robotics, Electronics, Telecommunication and Optoelectronics, Mechanical and Aeronautical Engineering, Thermodynamics, Material Science and Nanotechnology, Power Systems and Power Electronics.
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