像专业人士一样翻转比特:在嵌入式设备上精确地滚动

IF 1.7 4区 计算机科学 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Embedded Systems Letters Pub Date : 2023-09-25 DOI:10.1109/LES.2023.3298737
Anandpreet Kaur;Pravin Srivastav;Bibhas Ghoshal
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引用次数: 1

摘要

在本文中,我们介绍了Flip-On-Chip,这是第一个端到端工具,可以彻底检查嵌入式DRAM对rowhammer位翻转的脆弱性。我们的工具Flip-On-Chip利用DRAM地址映射信息高效、确定地执行双面RowHammer测试。我们在两个DRAM模块lpddr2和LPDDR4上评估了Flip-On-Chip。与文献中提供的最先进的方法相比,我们提出的工具在LPDDR2上增加了7.34%的位翻转次数,在LPDDR4上增加了99.97%。此外,Flip-On-Chip考虑了许多系统级参数来评估它们对触发Rowhammer位翻转的影响。
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Flipping Bits Like a Pro: Precise Rowhammering on Embedded Devices
In this article, we introduce Flip-On-Chip, the first end-to-end tool that thoroughly examines the vulnerability of embedded DRAM against rowhammer bit flips. Our tool, Flip-On-Chip, utilizes DRAM address mapping information to efficiently and deterministically perform a double-sided RowHammer test. We evaluated Flip-On-Chip on two DRAM modules: 1) LPDDR2 and 2) LPDDR4. It is found that our proposed tool increases the number of bit flips by 7.34 % on LPDDR2 and by 99.97 % on LPDDR4, as compared to state-of-the-art approaches provided in the literature. Additionally, Flip-On-Chip takes into account a number of system-level parameters to evaluate their influence on triggering Rowhammer bit flips.
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来源期刊
IEEE Embedded Systems Letters
IEEE Embedded Systems Letters Engineering-Control and Systems Engineering
CiteScore
3.30
自引率
0.00%
发文量
65
期刊介绍: The IEEE Embedded Systems Letters (ESL), provides a forum for rapid dissemination of latest technical advances in embedded systems and related areas in embedded software. The emphasis is on models, methods, and tools that ensure secure, correct, efficient and robust design of embedded systems and their applications.
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