Pragna Bhaskar;Ethan Shackelford;Emily K. McGuinness;Mohan Kathaperumal;Mark D. Losego;Madhavan Swaminathan
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Effect of Vapor Phase Infiltration on Metal-Polymer Adhesion for Ultra-Low-k Dielectric Materials
This paper explores the effect of vapor phase infiltration (VPI) on ultra-low-k (ULK) dielectric materials. Adhesion of metals to these ultra-low-k polymers is an important factor in the fabrication of multilayer redistribution layer (RDL) structures and also the reliability of RDLs. ULK polymers have lower adhesion to metal films than the current industry standard, Ajinomoto Buildup Film (ABF). Earlier studies have shown an improvement in adhesion strength between metal films and benzocyclobutene-based polymers when a VPI treatment is used. In this study we evaluate the effect of VPI on other ULK polymers, having dielectric constants less than 2.5.
期刊介绍：
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
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