随机振动载荷下pop包装的应力分析与优化

Pub Date : 2023-01-01 DOI:10.1587/elex.20.20230390

Tiantian Zhang, Ping Zhu, Junjie Lian, Yunchun Liu

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引用次数: 0

摘要

采用有限元模型对随机振动载荷下包装对包装的应力进行了分析。通过灵敏度分析，分析了结构参数对焊点应力的影响。采用响应面法(RSM)进行应力拟合，并利用优化模块对POP包装的结构参数进行优化。结果表明，焊点上下应力分别降低0.016和0.0031 MPa。这种结构参数的优化提高了电子封装结构的可靠性。

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Stress analysis and optimization of pop package under random vibration loading

The stress analysis of packaging on packaging (POP) under random vibration loading is conducted using the finite element model. The effect of structural parameters on solder joint stresses is analyzed by sensitivity analysis. Stress fitting is performed using the response surface method (RSM), and the optimization module is used to optimi-ze the structural parameters of POP packaging. The results demonstrate a reduction of 0.016 and 0.0031 MPa in upper and lower solder joint stresses, respectively. This optimization of the structural parameters improves the reliability of the electronic packaging structure.

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