{"title":"2023片上网络(NOCS)研讨会","authors":"Partha Pratim Pande","doi":"10.1109/mdat.2023.3316128","DOIUrl":null,"url":null,"abstract":"<fig orientation=\"portrait\" position=\"float\" xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <graphic orientation=\"portrait\" position=\"float\" xlink:href=\"pande-3316128.tif\"/> </fig>\nThe highlight of this issue is the journal-first model adopted for the articles accepted in the 17th edition of the Networks-on-Chip (NOCS) Symposium. NOCS is held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person symposium after virtual and hybrid editions during the pandemic. NOCS is the premier event dedicated to interdisciplinary research on on-chip, package-scale, chip-to-chip, and datacenter rack-scale communication technology as well as architectures, design methods, applications, and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from interdisciplinary research communities and areas, including discrete optimization and algorithms, computer architecture, networking, circuits and systems, packaging, embedded systems, and design automation. We thank the Technical Program Chairs of NOCS 2023, Masoumeh (Azin) Ebrahimi and Sujay Deb, along with the General Chairs Mahdi Nikdast and Miquel Moreto, for the timely delivery of all the accepted NOCS papers to the <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">IEEE Design&Test</i> submission system for further processing. This special issue consists of 15 papers.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"11 ","pages":""},"PeriodicalIF":1.9000,"publicationDate":"2023-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The 2023 Networks-on-Chip (NOCS) Symposium\",\"authors\":\"Partha Pratim Pande\",\"doi\":\"10.1109/mdat.2023.3316128\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<fig orientation=\\\"portrait\\\" position=\\\"float\\\" xmlns:mml=\\\"http://www.w3.org/1998/Math/MathML\\\" xmlns:xlink=\\\"http://www.w3.org/1999/xlink\\\"> <graphic orientation=\\\"portrait\\\" position=\\\"float\\\" xlink:href=\\\"pande-3316128.tif\\\"/> </fig>\\nThe highlight of this issue is the journal-first model adopted for the articles accepted in the 17th edition of the Networks-on-Chip (NOCS) Symposium. NOCS is held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person symposium after virtual and hybrid editions during the pandemic. NOCS is the premier event dedicated to interdisciplinary research on on-chip, package-scale, chip-to-chip, and datacenter rack-scale communication technology as well as architectures, design methods, applications, and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from interdisciplinary research communities and areas, including discrete optimization and algorithms, computer architecture, networking, circuits and systems, packaging, embedded systems, and design automation. We thank the Technical Program Chairs of NOCS 2023, Masoumeh (Azin) Ebrahimi and Sujay Deb, along with the General Chairs Mahdi Nikdast and Miquel Moreto, for the timely delivery of all the accepted NOCS papers to the <italic xmlns:mml=\\\"http://www.w3.org/1998/Math/MathML\\\" xmlns:xlink=\\\"http://www.w3.org/1999/xlink\\\">IEEE Design&Test</i> submission system for further processing. This special issue consists of 15 papers.\",\"PeriodicalId\":48917,\"journal\":{\"name\":\"IEEE Design & Test\",\"volume\":\"11 \",\"pages\":\"\"},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2023-10-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Design & Test\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1109/mdat.2023.3316128\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Design & Test","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/mdat.2023.3316128","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
The highlight of this issue is the journal-first model adopted for the articles accepted in the 17th edition of the Networks-on-Chip (NOCS) Symposium. NOCS is held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person symposium after virtual and hybrid editions during the pandemic. NOCS is the premier event dedicated to interdisciplinary research on on-chip, package-scale, chip-to-chip, and datacenter rack-scale communication technology as well as architectures, design methods, applications, and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from interdisciplinary research communities and areas, including discrete optimization and algorithms, computer architecture, networking, circuits and systems, packaging, embedded systems, and design automation. We thank the Technical Program Chairs of NOCS 2023, Masoumeh (Azin) Ebrahimi and Sujay Deb, along with the General Chairs Mahdi Nikdast and Miquel Moreto, for the timely delivery of all the accepted NOCS papers to the IEEE Design&Test submission system for further processing. This special issue consists of 15 papers.
期刊介绍:
IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.