2023片上网络国际研讨会特刊

IF 1.9 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Design & Test Pub Date : 2023-10-20 DOI:10.1109/mdat.2023.3313970
Mahdi Nikdast, Miquel Moreto, Masoumeh Azin Ebrahimi, Sujay Deb
{"title":"2023片上网络国际研讨会特刊","authors":"Mahdi Nikdast, Miquel Moreto, Masoumeh Azin Ebrahimi, Sujay Deb","doi":"10.1109/mdat.2023.3313970","DOIUrl":null,"url":null,"abstract":"The International Symposium on networks-on-chip (NOCS) serves as the premier interdisciplinary meeting for research on NoC architecture, implementation, analysis, optimization, and verification, encompassing various aspects of NoCs for embedded high-performance computing systems, un-core and system-level NoCs, inter/intrachip, and rack-scale networks. Similar to previous years, this event has been held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person conference after virtual and hybrid editions during the pandemic.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"1 4","pages":""},"PeriodicalIF":1.9000,"publicationDate":"2023-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Special Issue on the 2023 International Symposium on Networks-on-Chip (NOCS 2023)\",\"authors\":\"Mahdi Nikdast, Miquel Moreto, Masoumeh Azin Ebrahimi, Sujay Deb\",\"doi\":\"10.1109/mdat.2023.3313970\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The International Symposium on networks-on-chip (NOCS) serves as the premier interdisciplinary meeting for research on NoC architecture, implementation, analysis, optimization, and verification, encompassing various aspects of NoCs for embedded high-performance computing systems, un-core and system-level NoCs, inter/intrachip, and rack-scale networks. Similar to previous years, this event has been held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person conference after virtual and hybrid editions during the pandemic.\",\"PeriodicalId\":48917,\"journal\":{\"name\":\"IEEE Design & Test\",\"volume\":\"1 4\",\"pages\":\"\"},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2023-10-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Design & Test\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1109/mdat.2023.3313970\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Design & Test","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/mdat.2023.3313970","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0

摘要

片上网络(NOCS)国际研讨会是研究片上网络架构、实现、分析、优化和验证的主要跨学科会议,涵盖了嵌入式高性能计算系统、非核和系统级网络、芯片间/芯片内网络和机架规模网络的NOCS的各个方面。与往年类似,本次活动与嵌入式系统周(ESWEEK)同时举行。今年,NOCS于2023年9月21日至22日在德国汉堡举行,标志着继大流行期间的虚拟会议和混合会议之后,它又回到了完全面对面的会议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Special Issue on the 2023 International Symposium on Networks-on-Chip (NOCS 2023)
The International Symposium on networks-on-chip (NOCS) serves as the premier interdisciplinary meeting for research on NoC architecture, implementation, analysis, optimization, and verification, encompassing various aspects of NoCs for embedded high-performance computing systems, un-core and system-level NoCs, inter/intrachip, and rack-scale networks. Similar to previous years, this event has been held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person conference after virtual and hybrid editions during the pandemic.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
IEEE Design & Test
IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
3.80
自引率
5.00%
发文量
98
期刊介绍: IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.
期刊最新文献
Silicon Lifecycle Management (SLM): Requirements, Trends, and Opportunities Exploring Resilience of LPDRAM against RowHammer Interview With Vishwani Agrawal IEEE Design & Test Publication Information DATE 2024: Consolidating the New Conference Format
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1