勘误:扇出式晶圆级封装中毫米波应用的封装天线设计与测量 [IEICE Electronics Express Vol.

IF 0.8 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Ieice Electronics Express Pub Date : 2023-12-10 DOI:10.1587/elex.20.20238001
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Erratum:Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package [IEICE Electronics Express Vol. 19 (2022) No. 14 pp. 20220122]
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来源期刊
Ieice Electronics Express
Ieice Electronics Express 工程技术-工程:电子与电气
CiteScore
1.50
自引率
37.50%
发文量
119
审稿时长
1.1 months
期刊介绍: An aim of ELEX is rapid publication of original, peer-reviewed short papers that treat the field of modern electronics and electrical engineering. The boundaries of acceptable fields are not strictly delimited and they are flexibly varied to reflect trends of the fields. The scope of ELEX has mainly been focused on device and circuit technologies. Current appropriate topics include: - Integrated optoelectronics (lasers and optoelectronic devices, silicon photonics, planar lightwave circuits, polymer optical circuits, etc.) - Optical hardware (fiber optics, microwave photonics, optical interconnects, photonic signal processing, photonic integration and modules, optical sensing, etc.) - Electromagnetic theory - Microwave and millimeter-wave devices, circuits, and modules - THz devices, circuits and modules - Electron devices, circuits and modules (silicon, compound semiconductor, organic and novel materials) - Integrated circuits (memory, logic, analog, RF, sensor) - Power devices and circuits - Micro- or nano-electromechanical systems - Circuits and modules for storage - Superconducting electronics - Energy harvesting devices, circuits and modules - Circuits and modules for electronic displays - Circuits and modules for electronic instrumentation - Devices, circuits and modules for IoT and biomedical applications
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