在 PVT-AlN 衬底上通过 HVPE 均相外延制作独立的 AlN 衬底

IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Semiconductor Science and Technology Pub Date : 2023-12-06 DOI:10.1088/1361-6641/ad12df
Liu Ting, Qian Zhang, Xu Li, Minghao Chen, Chunhua Du, Maosong Sun, Jia Wang, Shuxin Tan, Jicai Zhang
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引用次数: 0

摘要

采用氢化物气相外延(HVPE)技术在物理气相输运(PVT)生长的AlN衬底上实现了AlN厚膜的同外延生长。然后通过机械磨削PVT-AlN衬底得到厚度为200 μm的独立AlN衬底。生长后的HVPE AlN层表面光滑,原子台阶长且平行。独立式hpe - aln衬底无裂纹,无应力。与PVT-AlN衬底相比,hpe - aln衬底不仅具有更好的晶体质量,而且C、O和Si杂质浓度也大大降低。在265 nm处,200 μm厚的独立AlN衬底的深紫外透过率高达66%。这种性能完全符合基于algan的深紫外光电器件的要求。
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Fabrication of a freestanding AlN substrate via HVPE homoepitaxy on a PVT-AlN substrate
Hydride vapor phase epitaxy (HVPE) is employed for the homoepitaxial development of AlN thick films on AlN substrates grown via physical vapor transport (PVT). A freestanding AlN substrate with a 200 μm thickness is then obtained by mechanically grinding away the PVT-AlN substrate. The as-grown HVPE AlN layer has a smooth surface with long parallel atomic steps. The freestanding HVPE-AlN substrate is crack-free and stress-free. In comparison to PVT-AlN substrate, HVPE-AlN substrate not only has better crystal quality but also substantially lower C, O, and Si impurity concentrations. The deep ultraviolet transmittance of the 200 μm thick freestanding AlN substrate is as high as 66% at 265 nm. This performance aligns perfectly with the demands of AlGaN-based deep ultraviolet optoelectronic devices.
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来源期刊
Semiconductor Science and Technology
Semiconductor Science and Technology 工程技术-材料科学:综合
CiteScore
4.30
自引率
5.30%
发文量
216
审稿时长
2.4 months
期刊介绍: Devoted to semiconductor research, Semiconductor Science and Technology''s multidisciplinary approach reflects the far-reaching nature of this topic. The scope of the journal covers fundamental and applied experimental and theoretical studies of the properties of non-organic, organic and oxide semiconductors, their interfaces and devices, including: fundamental properties materials and nanostructures devices and applications fabrication and processing new analytical techniques simulation emerging fields: materials and devices for quantum technologies hybrid structures and devices 2D and topological materials metamaterials semiconductors for energy flexible electronics.
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