基于 3D 异构集成无源器件技术的具有良好选择性的小型化宽带带通滤波器

IF 1.1 4区 计算机科学 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Iet Microwaves Antennas & Propagation Pub Date : 2023-12-25 DOI:10.1049/mia2.12447
Yujin Zhou, Jun Zhou, Chonghu Cheng, Yong Cheng
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引用次数: 0

摘要

基于三维(3D)异质集成无源器件技术,提出了具有良好频率选择性和宽阻带的小型化宽带滤波器。所提出的六阶宽带带通滤波器基于磁耦合加载的高通-低通叠加拓扑结构,通过三维异质集成工艺实现,将砷化镓基和玻璃基微纳尺度工艺集成在一起。然后,在玻璃基板上设计了具有低介质损耗正切的叠加电感器,并通过三维螺旋结构实现。因此,电感器具有较高的品质因数和较小的尺寸。块状电容器采用砷化镓薄膜工艺设计。最后,在 3.875 GHz(f0)频率上设计并制造了一个 3 分贝分数带宽为 42% 的原型。高于 30 dB 的上频带衰减扩展到 5.15f0 以上。它仅占 0.014 × 0.018 λ02 (1.1 × 1.42 mm2),其中 λ0 是 f0 时的自由空间波长。
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Miniaturised wideband bandpass filter with good selectivity based on 3D heterogeneous integrated passive device technology

The miniaturised wideband filter with good frequency selectivity and wide stopband is proposed, which is based on three-dimensional (3D) heterogeneous integrated passive device technology. The proposed sixth-order wideband bandpass filter is based on the magnetic-coupling-loaded highpass-lowpass lumped topology and implemented by the 3D heterogeneous integration process, integrating GaAs-based and Glass-based micro-nano-scale processes together. Then, lumped inductors are designed in the Glass substrate with low dielectric loss tangent and realised by a three-dimensional spiral structure. Therefore, the inductors have high quality factors and small sizes. The lumped capacitors are designed using the GaAs thin film process. Finally, a prototype with a 3-dB fractional bandwidth of 42% is designed and fabricated at 3.875 GHz (f0). The upper-stopband attenuation higher than 30 dB is extended to more than 5.15f0. It occupies only 0.014 × 0.018 λ02 (1.1 × 1.42 mm2), where λ0 is the free-space wavelength at f0.

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来源期刊
Iet Microwaves Antennas & Propagation
Iet Microwaves Antennas & Propagation 工程技术-电信学
CiteScore
4.30
自引率
5.90%
发文量
109
审稿时长
7 months
期刊介绍: Topics include, but are not limited to: Microwave circuits including RF, microwave and millimetre-wave amplifiers, oscillators, switches, mixers and other components implemented in monolithic, hybrid, multi-chip module and other technologies. Papers on passive components may describe transmission-line and waveguide components, including filters, multiplexers, resonators, ferrite and garnet devices. For applications, papers can describe microwave sub-systems for use in communications, radar, aerospace, instrumentation, industrial and medical applications. Microwave linear and non-linear measurement techniques. Antenna topics including designed and prototyped antennas for operation at all frequencies; multiband antennas, antenna measurement techniques and systems, antenna analysis and design, aperture antenna arrays, adaptive antennas, printed and wire antennas, microstrip, reconfigurable, conformal and integrated antennas. Computational electromagnetics and synthesis of antenna structures including phased arrays and antenna design algorithms. Radiowave propagation at all frequencies and environments. Current Special Issue. Call for papers: Metrology for 5G Technologies - https://digital-library.theiet.org/files/IET_MAP_CFP_M5GT_SI2.pdf
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