带有电镀缺陷的硅通孔热变形数值研究

IF 1.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Multidiscipline Modeling in Materials and Structures Pub Date : 2024-01-02 DOI:10.1108/mmms-04-2023-0141
Chongbin Hou, Yang Qiu, Xingyan Zhao, Shaonan Zheng, Yuan Dong, Qize Zhong, Ting Hu
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引用次数: 0

摘要

目的 通过研究硅通孔(TSV)和铜垫之间的热机械相互作用,本研究旨在确定电镀缺陷在不同温度下对 TSV 上表面突起和内应力分布的影响,并为 TSV 的定位和电镀工艺的优化提供指导。设计/方法/途径建立了一个由 TSV(直径 100 微米,高 300 微米)、覆盖铜垫(2 微米厚)和内部滴状电镀缺陷(具有不同的尺寸和位置)组成的简化模型。分析和比较了这些模型在各种热条件下的表面整体变形和应力分布。大约在 250°C 时,TSV 颈部开始出现界面分层,温度越高,分层越明显。尽管电镀缺陷的几何形状或位置不同,但它在温度升高过程中始终承受着最高水平的应变和应力。但随着其半径的扩大或与上表面距离的增加,上表面的整体变形和 TSV 套圈处的应力集中呈下降趋势。然而,本文提出的方法深入研究了 TSV 在温度、尺寸和电镀空隙位置等不同条件下的应变和应力分布,这可能有利于 TSV 的定位和电镀工艺的优化。
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A numerical study on thermal deformation of through silicon via with electroplating defect
PurposeBy investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the upper surface protrusion and internal stress distribution of the TSV at various temperatures and to provide guidelines for the positioning of TSVs and the optimization of the electroplating process.Design/methodology/approachA simplified model that consisted of a TSV (100 µm in diameter and 300 µm in height), a covering Cu pad (2 µm thick) and an internal drop-like electroplating defect (which had various dimensions and locations) was developed. The surface overall deformation and stress distribution of these models under various thermal conditions were analyzed and compared.FindingsThe Cu pad could barely suppress the upper surface protrusion of the TSV if the temperature was below 250 ?. Interfacial delamination started at the collar of the TSV at about 250 ? and became increasingly pronounced at higher temperatures. The electroplating defect constantly experienced the highest level of strain and stress during the temperature increase, despite its geometry or location. But as its radius expanded or its distance to the upper surface increased, the overall deformation of the upper surface and the stress concentration at the collar of the TSV showed a downward trend.Originality/valuePrevious studies have not examined the influence of the electroplating void on the thermal behavior of the TSV. However, with the proposed methodology, the strain and stress distribution of the TSV under different conditions in terms of temperature, dimension and location of the electroplating void were thoroughly investigated, which might be beneficial to the positioning of TSVs and the optimization of the electroplating process.
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来源期刊
CiteScore
3.70
自引率
5.00%
发文量
60
期刊介绍: Multidiscipline Modeling in Materials and Structures is published by Emerald Group Publishing Limited from 2010
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