二维各向异性弹性体之间的粘着接触

Nguyen Dinh Duc, Nguyen Van Thuong
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摘要

粘附力在智能化高科技设备(如现代光学、微机电和生物医学系统)的设计中发挥着至关重要的作用。然而,在文献中,粘合接触大多被认为是刚性基板与横向各向同性和各向同性弹性材料的接触。复合材料越来越多地应用于商场和智能高科技设备中。由于复合材料一般都是各向异性的,而接触体都是可变形的,因此考虑两种各向异性弹性材料的粘着接触更为实际。本文建立了各向异性弹性体的粘接接触模型,并推导了两个各向异性弹性体二维粘接接触的闭式解。利用斯特罗复变形式主义、解析延续法和 JKR 粘合模型的概念,建立了全场解和接触区域与外力的关系。我们将证明两种各向异性弹性材料的无摩擦接触只是本接触问题的一个特例,其解可通过设置粘附功等于零来获得。此外,我们还证明,通过适当设置接触半径和相应的材料常数,我们的求解也适用于刚性冲头在弹性半空间上的压痕问题。我们还提供了数值结果,以证明所开发解决方案的准确性、适用性和通用性。
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Adhesive contact between two-dimensional anisotropic elastic bodies
Adhesion plays a vital role in the design of smart and intelligent high-tech devices such as modern optical, microelectromechanical, and biomedical systems. However, in the literature, adhesive contact is mostly considered for contact of rigid substrates and transversely isotropic and isotropic elastic materials. The composite materials are increasingly used in the mart and intelligent high-tech devices. Since the composite materials are generally anisotropic and contact bodies are all deformable, it is more practical to consider the adhesive contact of two anisotropic elastic materials. In this paper, an adhesive contact model of anisotropic elastic bodies is established, and the closed-form solutions for two-dimensional adhesive contact of two anisotropic elastic bodies are derived. The full-field solutions and the relation for the contact region and applied force are developed using the Stroh complex variable formalism, the analytical continuation method, and concepts of the JKR adhesive model. We will show that the frictionless contact of two anisotropic elastic materials is just a special case of the present contact problem, and its solutions can be obtained by setting the work of adhesion equal to zero. In addition, we also show that our present solutions are valid for the problems of indentation by a rigid punch on an elastic half-space through a proper placement of the contact radius and the corresponding material constant. Numerical results are provided to demonstrate the accuracy, applicability, and versatility of the developed solutions.
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