集成检测和处理功能的智能图像传感器的结构设计

Guofang Zhai, Songbo Wu, Yao Yao, Ruimeng Zhang
{"title":"集成检测和处理功能的智能图像传感器的结构设计","authors":"Guofang Zhai, Songbo Wu, Yao Yao, Ruimeng Zhang","doi":"10.1117/12.3006844","DOIUrl":null,"url":null,"abstract":"This paper first introduces the application background of detection and processing integrated intelligent image sensor, and proposes an overall architecture of intelligent image sensor that uses hybrid stacking process for vertical interconnection. Among them, the top pixel layer mainly contains 10K×10K 5um pixel array and row and column drive array, which gives the pixel structure, simulates and analyzes the pixel noise index and effectively guides the design of the readout circuit structure. The lower chip layer mainly contains readout circuits, image signal processing ISPs, general-purpose CPU units, AI neural processing units, and on-chip SRAM. The image signal processing ISP function and the AI neural processing unit are introduced in detail, and the FPGA verification results of the AI neural processing unit are given.","PeriodicalId":502341,"journal":{"name":"Applied Optics and Photonics China","volume":"124 ","pages":"129630K - 129630K-11"},"PeriodicalIF":0.0000,"publicationDate":"2023-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Architecture design of intelligent image sensor integrated with detection and processing\",\"authors\":\"Guofang Zhai, Songbo Wu, Yao Yao, Ruimeng Zhang\",\"doi\":\"10.1117/12.3006844\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper first introduces the application background of detection and processing integrated intelligent image sensor, and proposes an overall architecture of intelligent image sensor that uses hybrid stacking process for vertical interconnection. Among them, the top pixel layer mainly contains 10K×10K 5um pixel array and row and column drive array, which gives the pixel structure, simulates and analyzes the pixel noise index and effectively guides the design of the readout circuit structure. The lower chip layer mainly contains readout circuits, image signal processing ISPs, general-purpose CPU units, AI neural processing units, and on-chip SRAM. The image signal processing ISP function and the AI neural processing unit are introduced in detail, and the FPGA verification results of the AI neural processing unit are given.\",\"PeriodicalId\":502341,\"journal\":{\"name\":\"Applied Optics and Photonics China\",\"volume\":\"124 \",\"pages\":\"129630K - 129630K-11\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-12-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applied Optics and Photonics China\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.3006844\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Optics and Photonics China","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.3006844","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文首先介绍了检测处理一体化智能图像传感器的应用背景,并提出了采用混合堆叠工艺进行垂直互联的智能图像传感器整体架构。其中,上层像素层主要包含 10K×10K 5um 像素阵列和行、列驱动阵列,给出像素结构,模拟分析像素噪声指标,有效指导读出电路结构设计。芯片下层主要包含读出电路、图像信号处理 ISP、通用 CPU 单元、人工智能神经处理单元和片上 SRAM。详细介绍了图像信号处理 ISP 功能和人工智能神经处理单元,并给出了人工智能神经处理单元的 FPGA 验证结果。
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Architecture design of intelligent image sensor integrated with detection and processing
This paper first introduces the application background of detection and processing integrated intelligent image sensor, and proposes an overall architecture of intelligent image sensor that uses hybrid stacking process for vertical interconnection. Among them, the top pixel layer mainly contains 10K×10K 5um pixel array and row and column drive array, which gives the pixel structure, simulates and analyzes the pixel noise index and effectively guides the design of the readout circuit structure. The lower chip layer mainly contains readout circuits, image signal processing ISPs, general-purpose CPU units, AI neural processing units, and on-chip SRAM. The image signal processing ISP function and the AI neural processing unit are introduced in detail, and the FPGA verification results of the AI neural processing unit are given.
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