大芯片挑战、模式和架构

IF 6.2 3区 综合性期刊 Q1 Multidisciplinary Fundamental Research Pub Date : 2024-11-01 DOI:10.1016/j.fmre.2023.10.020
Yinhe Han , Haobo Xu , Meixuan Lu , Haoran Wang , Junpei Huang , Ying Wang , Yujie Wang , Feng Min , Qi Liu , Ming Liu , Ninghui Sun
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引用次数: 0

摘要

随着摩尔定律的终结,通过晶体管缩放实现高性能芯片变得越来越具有挑战性。为了提高性能,增加芯片面积以集成更多的晶体管已成为必不可少的方法。然而,由于最大光圈面积、成本和制造良率等限制,芯片的面积无法持续增加,并且会遇到所谓的“面积墙”。在本文中,我们提供了一个详细的分析,并提出了一个实用的解决方案,大芯片,作为一种新的芯片形式,不断提高性能。介绍了一种评估大芯片性能的模型,并讨论了其结构。最后,给出了大芯片未来的发展趋势。
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The Big Chip: Challenge, model and architecture
As Moore’s Law comes to an end, the implementation of high-performance chips through transistor scaling has become increasingly challenging. To improve performance, increasing the chip area to integrate more transistors has become an essential approach. However, due to restrictions such as the maximum reticle area, cost, and manufacturing yield, the chip’s area cannot be continuously increased, and it encounters what is known as the “area-wall”. In this paper, we provide a detailed analysis of the area-wall and propose a practical solution, the Big Chip, as a novel chip form to continuously improve performance. We introduce a performance model for evaluating Big Chip and discuss its architecture. Finally, we derive the future development trends of the Big Chip.
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来源期刊
Fundamental Research
Fundamental Research Multidisciplinary-Multidisciplinary
CiteScore
4.00
自引率
1.60%
发文量
294
审稿时长
79 days
期刊介绍:
期刊最新文献
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