{"title":"工程摩擦学、加工和建模","authors":"Yunn Lin Hwang, Thangaprakash Sengodan","doi":"10.4028/b-jw3nji","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":11306,"journal":{"name":"Defect and Diffusion Forum","volume":"25 21","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-01-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Engineering Tribology, Processing and Modeling\",\"authors\":\"Yunn Lin Hwang, Thangaprakash Sengodan\",\"doi\":\"10.4028/b-jw3nji\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":11306,\"journal\":{\"name\":\"Defect and Diffusion Forum\",\"volume\":\"25 21\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-01-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Defect and Diffusion Forum\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4028/b-jw3nji\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Physics and Astronomy\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Defect and Diffusion Forum","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4028/b-jw3nji","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Physics and Astronomy","Score":null,"Total":0}
期刊介绍：
Defect and Diffusion Forum (formerly Part A of ''''Diffusion and Defect Data'''') is designed for publication of up-to-date scientific research and applied aspects in the area of formation and dissemination of defects in solid materials, including the phenomena of diffusion. In addition to the traditional topic of mass diffusion, the journal is open to papers from the area of heat transfer in solids, liquids and gases, materials and substances. All papers are peer-reviewed and edited. Members of Editorial Boards and Associate Editors are invited to submit papers for publication in “Defect and Diffusion Forum” . Authors retain the right to publish an extended and significantly updated version in another periodical.
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