降低环境压力下的卷对卷压印 PDMS 微结构

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Microelectromechanical Systems Pub Date : 2023-12-05 DOI:10.1109/JMEMS.2023.3336740
Olli-Heikki Huttunen;Johanna Hiitola-Keinänen;Jarno Petäjä;Eero Hietala;Hannu Lindström;Jussi Hiltunen
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引用次数: 0

摘要

要将相关科研成果用于商业用途,以及在大规模实验研究中需要成百上千个具有可重复性能的装置,就必须大批量制造微结构。聚二甲基硅氧烷(PDMS)是学术界制备微流控测试装置最广泛使用的材料之一。这也推动了辊对辊压印技术的发展,以实现基于 PDMS 的设备的大批量制造。复制过程中的气泡夹带一直是一个问题,会导致微结构出现缺陷。在真空中进行压印是一种众所周知的避免气泡产生的方法,但尚未应用于卷对卷加工。在这项工作中,我们使用 PDMS 硅弹性体作为压印抗蚀剂,展示了一种降低环境压力的辊对辊压印工艺。我们观察到,当环境压力从 1 个大气压降至 1/8 个大气压时,单个微特征中由气泡引起的缺陷数量从 100 % 降至 < 1 %。[2023-0063]
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Roll to Roll Imprinting PDMS Microstructures Under Reduced Ambient Pressures
High-volume manufacturing of microstructures is essential for the uptake of the related scientific results for commercial use and also if hundreds or thousands of devices with repeatable performance are needed during the large-scale experimental research. Polydimethyl siloxane (PDMS) is one of the most widely used materials for academia to prepare microfluidic test devices. This has also motivated the development of roll-to-roll imprinting towards the fabrication of PDMS-based devices at high volumes. The gas bubble entrapping during the replication process has remained an issue resulting in defects in the microstructure. Performing imprinting in vacuum is a well-known method to avoid bubbles but it has not been applied in roll-to-roll processing. In this work we demonstrated a reduced ambient pressure roll to roll imprinting process using PDMS silicone elastomer as imprint resist. We observed the reduction in the number of bubble-originated defects in individual micro-features from 100 % to < 1 % when the ambient pressure was reduced from 1 atm to 1/8 atm. [2023-0063]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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