基于石墨烯和银的温度传感器全激光直写工艺。

IF 4.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Frontiers of Optoelectronics Pub Date : 2024-02-05 DOI:10.1007/s12200-024-00108-4
Qi Li, Ruijie Bai, Lianbo Guo, Yang Gao
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引用次数: 0

摘要

利用激光诱导银(LIS)作为电极和激光诱导石墨烯(LIG)作为温度传感层,采用全激光直写(LDW)方法制备了高灵敏度温度传感阵列。建立了一个包含相变机制的有限元分析(FEA)光热模型,以研究激光参数与石墨烯特性之间的关系,为激光功率为 1-5 W、激光扫描速度(大于 50 mm/s)时的激光加工参数选择提供指导。LIG 宽度和厚度的模拟数据与实验数据的偏差分别小于 5%和 9%。此外,还研究了 LIG 的电气性能和温度响应性。通过改变激光工艺参数,LIG 烧蚀沟槽的厚度可在 30-120 μm 范围内调节,LIG 的电阻率可在 0.031-67.2 Ω-m 范围内调节。计算得出的电阻温度系数(TCR)百分比为-0.58%/°C。此外,还通过有关 LIS 的实验和模拟数据对有限元分析光热模型进行了研究,实验和模拟之间的平均偏差小于 5%。LIS 传感样品的厚度约为 14 μm,电阻率为 0.0001-100 Ω-m,对温度和压力刺激不敏感。此外,对于基于 LIS-LIG 的温度传感阵列,引入校正因子以补偿 LIG 温度传感受压力刺激的干扰,温度测量差值从 11.2 ℃ 降至 2.6 ℃,表明温度测量精度良好。
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All laser direct writing process for temperature sensor based on graphene and silver.

A highly sensitive temperature sensing array is prepared by all laser direct writing (LDW) method, using laser induced silver (LIS) as electrodes and laser induced graphene (LIG) as temperature sensing layer. A finite element analysis (FEA) photothermal model incorporating a phase transition mechanism is developed to investigate the relationship between laser parameters and LIG properties, providing guidance for laser processing parameters selection with laser power of 1-5 W and laser scanning speed (greater than 50 mm/s). The deviation of simulation and experimental data for widths and thickness of LIG are less than 5% and 9%, respectively. The electrical properties and temperature responsiveness of LIG are also studied. By changing the laser process parameters, the thickness of the LIG ablation grooves can be in the range of 30-120 μm and the resistivity of LIG can be regulated within the range of 0.031-67.2 Ω·m. The percentage temperature coefficient of resistance (TCR) is calculated as - 0.58%/°C. Furthermore, the FEA photothermal model is studied through experiments and simulations data regarding LIS, and the average deviation between experiment and simulation is less than 5%. The LIS sensing samples have a thickness of about 14 μm, an electrical resistivity of 0.0001-100 Ω·m is insensitive to temperature and pressure stimuli. Moreover, for a LIS-LIG based temperature sensing array, a correction factor is introduced to compensate for the LIG temperature sensing being disturbed by pressure stimuli, the temperature measurement difference is decreased from 11.2 to 2.6 °C, indicating good accuracy for temperature measurement.

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来源期刊
Frontiers of Optoelectronics
Frontiers of Optoelectronics ENGINEERING, ELECTRICAL & ELECTRONIC-
CiteScore
7.80
自引率
0.00%
发文量
583
期刊介绍: Frontiers of Optoelectronics seeks to provide a multidisciplinary forum for a broad mix of peer-reviewed academic papers in order to promote rapid communication and exchange between researchers in China and abroad. It introduces and reflects significant achievements being made in the field of photonics or optoelectronics. The topics include, but are not limited to, semiconductor optoelectronics, nano-photonics, information photonics, energy photonics, ultrafast photonics, biomedical photonics, nonlinear photonics, fiber optics, laser and terahertz technology and intelligent photonics. The journal publishes reviews, research articles, letters, comments, special issues and so on. Frontiers of Optoelectronics especially encourages papers from new emerging and multidisciplinary areas, papers reflecting the international trends of research and development, and on special topics reporting progress made in the field of optoelectronics. All published papers will reflect the original thoughts of researchers and practitioners on basic theories, design and new technology in optoelectronics. Frontiers of Optoelectronics is strictly peer-reviewed and only accepts original submissions in English. It is a fully OA journal and the APCs are covered by Higher Education Press and Huazhong University of Science and Technology. ● Presents the latest developments in optoelectronics and optics ● Emphasizes the latest developments of new optoelectronic materials, devices, systems and applications ● Covers industrial photonics, information photonics, biomedical photonics, energy photonics, laser and terahertz technology, and more
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